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Product filed under:
Computers and Industrial Computers and Industrial
Cincoze DS-1100 7/6th Generation Intel® Core™ i3 / i5 / i7 High Performance, Modular and Expandable Rugged Embedded Computer
| System | |
| Processor | • 7th Generation Intel® CPU (Kaby Lake-S) - Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP) - Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP) - Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP) - Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP) - Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP) - Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP) - Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP) • 6th Generation Intel® CPU (Skylake-S) - Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP) - Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP) - Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP) - Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP) - Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP) - Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP) - Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP) - Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP) - Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP) - Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP) |
| Chipset | Intel® Q170 |
| Graphics | .Integrated Intel® HD Graphics .Three Independent Display |
| Memory | 2x DDR4 2133/2400 MHz SO-DIMM Sockets * Core I 7th Generation / Celeron Processor Supports Up to 2400MHz * Core I 6th Generation / Pentium / Celeron Processor Supports Up to 2133MHz Supports Un-buffered and Non-ECC Type Up to 64 GB |
| BIOS | AMI 16 Mbit SPI BIOS |
| Graphics | .Integrated Intel® HD Graphics .Three Independent Display |
| Audio | Realtek ALC888-GR, High Definition Audio |
| I/O | |
| LAN | 2x 10/100/1000 Mbps, RJ45 GbE1: Intel I219-LM GbE2: Intel I210 Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE Optional Module .4x 10/100/1000 Mbps, RJ45 Port .4x 10/100/1000 Mbps, M12 Port |
| DVI | 1x DVI-I connector, Up to 1920x1080@60Hz |
| DP | 2x DisplayPort Connector (4096 x 2304 @ 60Hz, According to CPU Specifications) * Verified maximum resolution: 3840x2160 |
| PoE+ | Optional Module .4x PoE+, Individual port 25.5W, RJ45 Port .4x PoE+, Individual port 25.5W, M12 Port |
| Serial Port | 2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9 Optional Module .4x RS-232/422/485, DB9 Connector .4x Electrical Isolated RS-232/422/485, DB9 Connector |
| Expansion | |
| Mini PCI Express | 3x Full-size Mini PCIe Supports Wireless & I/O Expansion |
| SIM Socket | 1x SIM Socket |
| CMI (Combined Multiple I/O Interface) | 2x CMI Interface for CMI Modules |
| CFM (Control Function Module) Interface | 1x CFM Interface for CFM Modules |
| Storage | |
| SSD/HDD | 2x 2.5" SATA HDD/SSD bay (Gen3) One Internal, One Front Accessable Support RAID 0/1, Hot Swap |
| mSATA | 3x mSATA (Shared by Mini-PCIe Socket) (Gen3) |
| Power Supply | |
| Power Type | AT/ATX |
| Power Input Voltage | 9~48VDC |
| Mechanical | |
| Dimensions | 227 x 261 x 88 mm |
| Weight | 4.7kg |
| Mounting | Wall |
| Environmental | |
| Operating Temperature | 7th Generation Intel® CPU (Kaby Lake-S) - 35W TDP CPU: -40°C to 50°C - 51W~65W TDP CPU: -40°C to 45°C 6th Generation Intel® CPU (Skylake-S) - 35W TDP CPU: -40°C to 70°C - 51~65W TDP CPU: -40°C to 50°C (With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14) |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 70°C @ 95% RH (non-Condensing) |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) |
