EMC Brochure

Sporadic fieldbus failures in industrial plants are frequently traced not to the bus itself, but to electromagnetic interference coupling onto cable shields through inadequate equipotential bonding. As variable-speed drives and automation density increase, so do the high-frequency currents that load bonding systems beyond their design limits. This brochure from Indu-Sol GmbH covers the principles, products, and services needed to assess, correct, and monitor EMC conditions in PROFINET and PROFIBUS environments.

Compatible with PROmanage® NT network monitoring software for integrated EMC condition monitoring alongside fieldbus diagnostics.

Key Topics
EMC Fundamentals & Reference Values Covers shielding, earthing, coupling mechanisms, and recommended current and impedance thresholds for PE/PA conductors, motor cable shielding, and signal cable shielding per DIN EN 50310 and VDE standards.

Meshed Equipotential Bonding (MESH-BN): Explains the limitations of star-topology bonding systems and the advantages of distributed, low-impedance meshed bonding for high-frequency current environments.

EMC Infrastructure Components: Details tin-plated conductor cables, EmClots® fastening elements, EmClip® shield terminal systems, PROFINET/PROFIBUS +FE cables, and SymFlex® EMV-DRIVE symmetric motor cables.

Measurement & Diagnostic Tools: Covers the EmCheck® LSMZ I leakage current clamp, EmCheck® MWMZ II mesh resistance clamp, EmCheck® ISMZ I intelligent current clamp, and EMV-INspektor® V2 multi-channel analyzer.

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Permanent EMC Monitoring: Describes integration of EMV-INspektor® V2 with PROmanage® NT for continuous shield current monitoring, threshold alerting, and correlation with fieldbus condition data.

Professional Services & Training: Includes EMC measurement services, situation analysis, equipotential bonding optimization consulting, and two-day hands-on EMC training at Indu-Sol's facility.

Who This Is For

• Controls and automation engineers investigating intermittent fieldbus errors with no clear source in the bus itself
• Maintenance managers in high-drive-density environments such as automotive, packaging, and food and beverage facilities
• System integrators designing or commissioning PROFINET and PROFIBUS installations in EMC-challenging environments
• Electrical engineers responsible for equipotential bonding system design, verification, and compliance with DIN EN 50310

Download the Brochure >>
The InduSol America EMC & Equipotential Bonding Brochure is available as a free PDF download. For questions about any product or service covered in this brochure, contact InduSol America at [email protected] or +1 (678) 880-6910.