Industrial PC, Inc. Product

DS-1300 10th Generation Intel® Xeon/Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer

Image of DS 1300
System
Processor Intel® Xeon® Series Processor ( 80W / 35W ):
• Intel® Xeon® W-1270E 8 Cores Up to 4.8 GHz, TDP 80W
• Intel® Xeon® W-1250E 6 Cores Up to 4.7 GHz, TDP 80W
• Intel® Xeon® W-1290TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Xeon® W-1270TE 8 Cores Up to 4.4 GHz, TDP 35W
• Intel® Xeon® W-1250TE 6 Cores Up to 3.8 GHz, TDP 35W
Intel® Core® Series Processor ( 65W / 35W ):
• Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W
• Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W
• Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W
• Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W
• Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W
• Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W
Chipset Intel® W480E Chipset
Graphics Integrated Intel® UHD-630 Graphics
Memory 2x DDR4 2933/2666/2400 SO-DIMM Socket
* Xeon / i9 / i7 Processor Supports Up to 2933MHz
* i5 / i3 Processor Supports Up to 2666 MHz
Supports Un-buffered and Non-ECC Type Up to 64GB
BIOS AMI BIOS
I/O
LAN • 2 x GbE LAN, RJ45
- GbE1: Intel® I219
- GbE2: Intel® I210
COM 2 x RS-232/422/485 with Auto Flow Control ( Supports 5V / 12V ), DB9
USB • 2 x 10Gbps USB 3.2 Gen2, Type A
• 4 x 5Gbps USB 3.2 Gen1, Type A
• 2 x 480Mbps USB 2.0, Type A
PS/2 1 x PS/2, 6 Pin Mini-DIN Female Connector
Audio 1 x Line-out, Phone Jack 3.5mm
1 x Mic-in, Phone Jack 3.5mm
Expansion
Mini PCI Express 3 x Full-size Mini-PCIe Socket
SIM Socket 2 x SIM Socket
CMI (Combined Multiple I/O Interface) • 2 x High Speed CMI Interface for optional CMI Module Expansion
• 2 x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface 1 x CFM IGN Interface for optional CFM-IGN Module Expansion
Storage
SSD/HDD • 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 )
• 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 )
mSATA 3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )
M.2 SSD 1x M.2 Key M Type 2280 Socket, Support PCIe x4 NVMe SSD or SATA SSD ( SATA 3.0 )
RAID Support RAID 0/1/5/10
Power Supply
Input 9 - 48VDC, 3-pin Terminal Block
Power Budget 180W
Mechanical
Dimensions 227 x 261 x 88 mm
Weight 4.5kg
Mounting Wall Mount
Environmental
Operating Temperature • 35W TDP Processor: -40°C to 70°C
• 58W – 65W TDP Processor: -40~50°C (With External Fan Kit)
• 80W TDP Processor: -40~40°C (With External Fan Kit)

* PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
* With extended temperature peripherals; Ambient with air flow
* According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature -40°C ~ 85°C
Humidity 95%RH @ 70°C (non-Condensing)
Vibration MIL-STD-810G
Shock MIL-STD-810G

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