Gidel Product


Model: Proc10M


The Proc10M module has been designed for use with carrier boards to enable tailoring solutions that significantly reduce risks

Image of Proc10M

The Startix10 MX offers 10X more DRAM and SRAM bandwidth than discrete DDR4 and QDR memories. Gidel’s Proc10M module is designed to enable easy use and immediate accessibility to this powerful technology for computer-based, embedded systems and edge computing. The combination of the Proc10M’s large FPGA, huge memory bandwidth and 1,600 Gb/s IOs enables unprecedented level of processing, system compactness and cost performance. The powerful Proc10M opens the way to implement diverse innovations and high-end applications, including: • Compact Broadcast and Image-Processing solutions enabling to grab data from multiple fast edge sensors and to perform image enhancements, processing, recognition, compression and AI inferences. • 5G and Radar combining high-speed digital I/O interfaces and edge computing such as FFTs to selectively reduce data and offload it via PCIe x16 or dedicated links. • Ultra-fast switch for wireline traffic management up to 800G and single device solution for Deep Packet Inspection (DPI) • AI training leveraging 128GB density, HBM2s’ huge bandwidth and the FPGA’s massive logic and DSP blocks. High-end solutions can be achieved within remarkable short time using the Proc10M module, Gidel/user carrier boards and Gidel’s powerful development suite, thus significantly accelerating the time to market and improving the ROI.

Key Features • Large HBM2 FPGA with ultra-compact module (97.4mm x 101mm / 3.83” x3.98”) • Flexible usage via customized carrier board or via Gidel’s carrier board • Stratix 10MX 2100 HBM2 FPGA: • 2,073,000 LEs • 7,920 18 x19 MAC • 5-level memory scheme (50TB/s+): • 300 GB/s access to DRAM • 90 GB/s access to SRAM • Max capacity>128 GB √ 8/16 GB on module √ up to 128 GB on carrier • 72 Transceivers with bandwidth > 1,600 Gb/s (TX+RX): • 48 x up to 26 Gb/s • 16 x up to 16 Gb/s or PCIe Gen3x16 • 8 x up to 16Gb/s • Option for 64 x up to 26 Gb/s • 374 I/Os supporting: • 26 x 3.3V IOs • 96 x LVDS (1.6Ghz/line) • 72 bit DDR4 interface • PLLs with jitter cleaners(100fs) • 10 dedicated input reference clocks • 2 x output reference clock • Supports up to 120W (@12V) • Active or passive cooling • May be used on half-length PCIe carrier board • Supported by Gidel Proc Dev Kit (via a PCIe carrier)

Proc10M Carrier Boards The Proc10M module has been designed for use with carrier boards to enable tailoring solutions that significantly reduce risks, costs and time to market. User carriers may incorporate any combination of Rx, Tx or full duplex transceivers. Gidel’s off-the-shelf carrier board can be used as is for deployment or as a reference design thus further improving the ROI. Gidel’s Proc1C half-length PCIe carrier includes PCIe Gen. 3 x16, 4 xQSFP28 (support 16 x 10GigEVision Links), PHS and GPIOs. The PHS interface enables connecting board-to-board or mounting a daughter board such as Gidel’s 8 xCoaXPress 12.

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