Intelligent inspection for flawless solder joints: 3D technology and EyeVision Software in action

In electronics manufacturing, even the slightest misalignment of pins or solder paste can lead to faulty solder joints and affect device performance. While 2D inspection methods are effective for many tasks, 3D technology offers additional precision for checking coplanarity, chip control, and solder paste dosing. The EyeVision software combines the strengths of both 2D and 3D inspection to ensure reliable quality control.

The Solution: precision with EyeVision Software

The ChipControl command set of EyeVision enables precise 3D measurements of pin heights, solder paste applications, and component alignments, allowing errors to be detected before soldering begins. High-resolution smart cameras, like the EyeCheck series, inspect pin alignment, solder paste dosing, and component positioning, reducing errors and increasing efficiency. From pin gap and lead frame inspection to wafer inspection and OCR recognition, EyeVision handles a variety of tasks with the highest precision, ensuring consistent, flawless electronics production.

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Seamless integration and future-proof Quality Control

With an intuitive drag-and-drop interface, EyeVision software is easy to set up and supports a wide range of components and inspection tasks, including THT, SMD, QFP, BGA, and more. It integrates seamlessly into factory systems via TCP/IP, Profinet, Modbus, and Ethernet IP, ensuring compatibility with existing workflows. As manufacturing progresses with automation and miniaturization, EyeVision's AI-powered 3D inspection guarantees maximum reliability at every stage of production.