RVSI Gets Order for Wafer Inspection System

System for a major semiconductor memory company is RVSI's fourth in 45 days

CANTON, Mass., June 24 /PRNewswire-FirstCall/-- Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) today said it has received an order for a WS-2500 bumped wafer inspection system from one of Asia's largest semiconductor memory manufacturers.  The semiconductor company plans to use the system for two- and three-dimensional defect inspection of semiconductor wafers.  The system represents RVSI's fourth WS-series system order in the past 45 days.

'Our recent orders and shipments indicate that semiconductor memory manufacturers appear to be standardizing on the WS-series,' said Frank L. Jacovino, General Manager of Wafer Level Products at RVSI's Semiconductor Equipment Group in Hauppauge, New York. 'This order was the second one from this particular memory manufacturer, and we now have systems either on order or in use by multiple semiconductor memory companies.  We are particularly pleased that the customer ordering this system also had an explicit requirement for 2-D defect inspection in addition to accurate height metrology.'

'As the wafer bump process transitions from development to mass production, RVSI's combination of MicroMap(TM) 3-D inspection and superior defect detection is rapidly becoming the standard for this full production phase,' said Michael Gray, the Semiconductor Equipment Group's Vice President of Sales. 'We've built nearly 2000 inspection systems that monitor approximately 80% of the world's integrated circuit package quality, RVSI has the unique technology and support structure needed to meet the challenging demands of 100% wafer inspection for mass production. Our competitors are still struggling to learn what RVSI has known about such demands for the past decade.'

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold 'bumps' that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps. Depending upon wafer size and other features, the WS-series is priced from $500,000 to $1 million per system.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, and pharmaceutical industries, RVSI holds approximately 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.