RVSI Gets Follow-on Order for WS-3000 Wafer Inspection System

09/04/2002
3 minutes

Order follows shipment approval for first of five planned systems

CANTON, MASSACHUSETTS - September 4, 2002 - Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) today said it has received a follow-on order for a 300mm bumped wafer inspection system from one of the world's largest microelectronics manufacturers.  Concurrently, RVSI said the first WS-3000 system ordered earlier in the year by that customer had been approved for shipment following extensive evaluation. The value of each system is in excess of $1 million.

The order is the second to be issued by this customer to RVSI following an extensive evaluation of RVSI's WS-series inspection system against that of RVSI's principal competitor in the field.  RVSI was selected by the microelectronics manufacturer as 'best of breed' in December 2001.  The customer has indicated a requirement for up to five systems over a 24-month period.

'This is a major milestone for RVSI in its bumped wafer inspection system program,' said Frank L. Jacovino, General Manager of Wafer Level Products at the Electronics Division of RVSI in Hauppauge, New York. 'Shipment authorization of the first system required a rigorous and exhaustive buy-off on each performance aspect of the WS-3000.  Having met those requirements, the customer is now able to initiate the process of purchasing additional systems to meet production requirements.'

'The competition that resulted in our selection as 'best of breed' was closely watched by other companies that are evaluating who will supply their integrated 2-D and 3-D inspection technology,' said Michael Gray, Vice President of Sales at the Electronics Division of RVSI in Hauppauge, New York. 'That RVSI is now successfully delivering equipment to and getting follow-on orders from this showcase account adds to our stature as the industry leader.'

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold 'bumps' that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps. Depending upon wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system.


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About RVSI
Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.

For further information contact:
Neal H. Sanders
(781) 302-2439

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