RVSI Gets Additional Order for Wafer Inspection System

CANTON, MASSACHUSETTS - July 30, 2001 - Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) today said it has received an order for the company's new WS-2500 Wafer Inspection System from a large U.S.-based semiconductor manufacturer.

"This is our third announced sale in less than a week," said Michael Gray, Vice President of Sales at the Electronics Division of RVSI in Hauppauge, New York. "What makes the order of particular interest is that the customer chose our product because of its ability to perform micron-level inspection at production speeds using 2-D camera-based technology.  Typically, RVSI's WS-series products have been chosen where 3-D height metrology is the determining factor.  However, as the clear industry standard for height metrology, we are gratified to see a customer recognize that our latest defect detection capabilities are also at the industry's leading edge."

Rather than traditional wire bonds, the newest generation of integrated circuits utilize microscopic-sized solder or gold "bumps" that are directly deposited on the wafer for electrical connections. RVSI's new product improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps. The WS-2500 is designed to handle the industry's standard 200 mm wafers, while the new WS-3000 inspects the semiconductor industry's new 300 mm wafers. The WS-2500 combines RVSI's proprietary high-speed 3-D laser technology with our new 2-D high resolution, state-of-the-art cameras to achieve superior measurement throughput and performance. A sophisticated user interface and software allow for fast and easy set-up of new wafers to minimize programming time. Features such as bump height, diameter, and absence/presence can easily be selected for inspection through specialized menus.

"As with our earlier announced orders, we won this sale in head-to-head competition against the latest product offerings from our competitors," said Frank L. Jacovino, General Manager of Wafer Level Products at the Electronics Division of RVSI in Hauppauge, New York. "The WS series is clearly becoming the industry standard for bump height metrology, with systems in place among the largest U.S. semiconductor companies and Asian subcontract manufacturers."

About RVSI
Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds approximately 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.