Robotic Vision Systems' WS-3000 Selected for Advanced Wafer Fab Facility in Europe

NASHUA, NEW HAMPSHIRE -- Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) today said its industry-leading WS-3000 wafer inspection system had been selected by a leading logic manufacturer for installation in that organization's new 300mm wafer fabrication in Europe.  The order is the fourth WS-series system ordered by this customer and the first destined for this facility.

Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the customer's specification mandated combined 2-D and 3-D inspection on one system; a capability offered by RVSI's WS-3000.  'Customers are increasingly moving toward requiring wafer inspection systems that incorporate both 2-D surface defect inspection and 3-D metrology or bump height measurement on a single platform,' Mr. Michaels said. 'The era of buying one system for surface defect review and another to perform bump metrology is at an end, and only those suppliers that can offer both features will be considered.'

Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group, noted the logic manufacturer has selected the mostcutting-edge technology for its new European wafer fab facility.  'This is their showcase 300mm facility,' Mr. Gray said. 'During this transition to larger substrates, the customer took the opportunity to re-survey the available technology, and our WS-series was recognized as the only viable combined 2-D/3-D platform. Every piece of equipment in the fab has been selected to put their best foot forward, and we are pleased to be selected, especially since this facility is dedicated to logic devices, the flagship of that organization's product line.'

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold 'bumps' that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies. 

Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange
Commission.