Robotic Vision Systems' WS-3000 Selected by Major Semiconductor Outsourced Assembly and Test Company

NASHUA, N.H., Dec. 8 -- Robotic Vision Systems, Inc. (RVSI) (OTC Bulletin Board: RVSI.OB) today said its industry-leading WS-3000 wafer inspection system had been selected by one of the world's largest outsourced semiconductor assembly and test companies.  The RVSI system will be installed in one of that organization's most advanced packaging facilities in Southeast Asia.  The sale represents a repeat WS-series order, and is the first WS-3000 system ordered by this customer.

Michael Gray, Vice President - Sales and Marketing for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the customer required production-speed combined 2-D and 3-D inspection on one system; a capability offered by RVSI's WS-3000.  ‘‘The era of buying one system for surface defect review and another to perform bump metrology is at an end, and only those suppliers that can offer both features will be considered,’‘ Mr. Gray said.  ‘‘Moreover, 100% bump inspection is increasingly being mandated by the semiconductor manufacturers who are the contract assembly and test companies' customers.  Better inspection is the key to ensuring that wafers have been bumped to spec, even as pricing requirements drive manufacturers to use less expensive, and therefore less controllable, bumping techniques.’‘

Mr. Gray also noted that this was the outsourced assembly and test organization's first 300mm bumped wafer inspection tool.   ‘‘During this transition to larger substrates, the customer took the opportunity to re-survey the available technology, and our WS-series was recognized as the only viable combined 2-D/3-D platform.  We are told this is just the first of a series of purchases of such equipment, and we are pleased to be selected.’‘

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies. 

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the cooperation of various creditors and the approval of the Bankruptcy Court for certain transactions, the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.