Robotic Vision Systems Gets Orders for Four WS-series Wafer Inspection Systems

NASHUA, N.H., April 28 -- Robotic Vision Systems, Inc. (RVSI) (OTC Bulletin Board: RVSI.OB) today said it has received orders for a total of four of its WS-series bumped wafer inspection systems from two of the world's largest manufacturers of bumped-wafer products.  The WS-3000 systems will be installed between June and August at facilities in Asia and North America.  The value of the orders is approximately $3 million.

Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the two orders, which came within days of one another in April, are evidence that the demand for metrology inspection of bumped wafers has reached critical mass.

‘‘When two of the most technologically astute users of flip-chip technology each place multi-unit orders back-to-back, you know the market is real, and that your technology is sound,’‘ Mr. Michaels said.  ‘‘Both of these customers view bumped wafer technology as a core component of their technology roadmap, and both have chosen RVSI to provide their 3D bump height metrology.  Further, because RVSI is the first supplier to reach a 'convergence point' of offering superior 2-D and 3-D capabilities in one system, they are also coming to rely on our surface defect inspection capabilities as well.’‘

Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group, noted that one of the customers would also use their WS-3000 systems for probe mark inspection, a new application of RVSI's technology. ‘‘Searching for defects created during wafer probing are a natural extension of the WS-series, and we have been pleased to work with this customer to open up that new application,’‘ Mr. Gray said.

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (OTC Bulletin Board: RVSI.OB) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.