Robotic Vision Systems Gets Order in Korea for WS-2500 Bumped Wafer Inspection System

RVSI's Semiconductor Equipment Group's extends its technical lead in 2-D defect detection

NASHUA, N.H., Jan. 6 /PRNewswire-FirstCall/-- Robotic Vision Systems, Inc. (RVSI) (OTC: RVSI.PK - News) today said it has received an order for its WS-2500 bumped wafer inspection system from a major Korean subcontract bumped wafer foundry previously using a competitive system. The order, the first WS-series system to be purchased by this organization, will be used specifically for surface defect inspection on bumped wafers being supplied to one of Asia's largest semiconductor manufacturers. Depending upon wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system.

Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the order was an important win because the customer has previously purchased a competing product for its 2-D inspection requirements. ‘‘We have been the industry standard for 3-D bump-height metrology for flip-chip wafers for the past three years,’‘ Mr. Michaels said. ‘‘Now, we are increasingly being viewed as the preferred solution for 2-D surface inspection of those wafers as well. Ultimately, the customer will need both capabilities in one product; RVSI is the first company to reach that point of convergence with superior 2-D and 3-D capabilities in the same system. Orders such as this give us considerable confidence about our place in the industry.’‘

‘‘This order is also indicative of Korea's importance in the implementation of bumped-wafer technology,’‘ said Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group. ‘‘Flat panel displays and low-profile chips are two of the principal types of semiconductor devices that have been rapid adopters of bumped wafer technology, and Korea is a center for the manufacture of these types of semiconductors. RVSI has a very strong leadership position among Korean companies with its WS-series products, and we see 2004 as a year of expanding sales in this region.’‘

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (RVSI.PK) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.