Robotic Vision Systems Gets Order in Japan for WS-series Inspection System

RVSI's Semiconductor Equipment Group's extends its technical lead in 2-D defect detection

NASHUA, NEW HAMPSHIRE -- Robotic Vision Systems, Inc. (RVSI) (RVSI.PK) today said it has received an order for its WS-series bumped wafer inspection system to be delivered to a major Japanese semiconductor company. The order, the first WS-series system to be purchased for this organization, will be used specifically for surface defect inspection of bumped wafers that have been fabricated by the semiconductor company.  Depending upon wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system.  The system is scheduled to ship in April 2004.

Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the order's importance was in the selection of RVSI for 2-D inspection requirements.  ‘‘There is little question that we're the industry's standard for 3-D bump-height wafer metrology,’‘ Mr. Michaels said.  ‘‘This order demonstrates that we are increasingly being viewed as having the best solution for 2-D surface inspection of those wafers as well. As in other orders where we have been selected recently, the customer will ultimately need both 2-D and 3-D capabilities in one product.  We are the first supplier to reach that point of convergence with superior 2-D and 3-D capabilities in the same system.’‘

Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group, said that Japan was expected to become an increasingly major factor in bumped wafer production.  ‘‘There was a time when the conventional wisdom said that bumped wafer inspection could be handled as a spot check,’‘ Mr. Gray said. ‘‘That belief was especially prevalent in Japan where expectations of upstream quality are especially high.  What manufacturers have found is that 100% inspection is an absolute requirement because low-cost techniques have become standard for bump deposition.  This means the market size will be a multiple of what we would have expected two or three years ago.’‘

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (RVSI.PK) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.