Robotic Vision Systems' 2-D and 3-D Wafer Inspection Systems Selected By Customers in Greater China

Already the industry standard in 3-D inspection, RVSI's Semiconductor Equipment Group is the increasing choice of customers requiring combined 2-D and 3-D on a single platform

NASHUA, NEW HAMPSHIRE -- Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) today said it has received two orders for its WS-series bumped wafer inspection system from test, assembly and packaging organizations in Greater China.  In both cases, RVSI's systems were chosen in competitive evaluations and both organizations' selection was based on RVSI providing both 2-D surface defect inspection and 3-D metrology solutions at production speed.  Such systems are typically priced, depending upon features, in a range of $500,000 to more than $1 million.

Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the orders were evidence that customers are increasingly moving toward requiring wafer inspection systems that incorporate both 2-D surface defect inspection and 3-D metrology or bump height measurement on a single platform.  ‘‘The two customers began with different approaches to wafer inspection, but both chose RVSI for the same reason: 2-D and 3-D on one platform,’‘ Mr. Michaels said. 

‘‘The first customer, one of Taiwan's largest subcontract assembly houses, has previously purchased separate systems for each inspection: RVSI for 3-D, a different vendor for 2-D.  Both vendors were told that, effective with this evaluation, they would require both functions on a single platform.

Both vendors' offerings were evaluated; RVSI's was the one selected,’‘ Mr. Michaels said. 

Mr. Michaels said the second customer had not previously purchased bumped wafer inspection equipment.  ‘‘They are a new organization in flip chip assembly.  They went through a rigorous evaluation criteria and told us that we had the only viable solution for 3-D, and that our 2-D solution was equal to and, in some applications, better than the best of the other vendors they reviewed.’‘

Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group, noted the second customer will be RVSI's first installation on mainland China.  ‘‘Flip chip has become synonymous with 300mm wafers and mainland China is emerging as the center for 300mm wafer production.  We have worked hard to develop key relationships with marketing organizations in that country, and believe that mainland China will become a very important market for our wafer inspection equipment.’‘

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Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability.

Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies. 

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.