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Teledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision.

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DALSA to Showcase Two New Products and Present at The Vision Show in Boston on June 10 - 12, 2008

POSTED 06/02/2008

 

WATERLOO, ON--(Marketwire - May 29, 2008) - DALSA Corporation (TSX: DSA), a leader in the design, manufacturing and deployment of digital imaging components for the machine vision market, will showcase two new products at The Vision Show in Boston, on June 10-12, 2008. An executive from the Company will be presenting at the technical conference about Breakthroughs in Dual Line Scan Technology.

Who:
DALSA Corporation (www.dalsa.com) is a leader in the design, manufacturing and deployment of digital imaging components for the machine vision market.

What:       
Visit DALSA's booth (#313) at The Vision Show where DALSA will be exhibiting the full breadth of its machine vision technology including: image sensors, cameras, frame grabbers, vision appliances and software.

The Company will introduce two new products:

             -- Spyder 3 4K CL -- A CameraLink version of the hugely
                popular Spyder 3 Line scan camera featuring DALSA's
                'dual-line scan sensor' technology

             -- Genie M1410 & C1410 cameras -- New color and monochrome
                additions to the Genie Series of GigE Vision-compliant
                cameras featuring a new sensor (SONY ICX 285) and offering
                higher levels of performance in speed.



 

The company will also present a series of interactive demonstrations to showcase their product expertise in the following areas: packaging inspection; line scan technology; area scan technology; image acquisition & image processing.

Technical Conference Participation: Breakthroughs in Dual-Line Scan Technology

Instructor: Xing-Fei He, Senior Product Manager, DALSA Corporation, will give a talk on how innovative dual-line scan technology, with high speed, high sensitivity, and lower noise, delivers greater dynamic range, especially in light-starved situations. He will also speak about functionally similar to TDI arrays

(Tuesday, June 10th, 3:00 - 5:00 pm).

Xing-Fei manages DALSA's Line scan and TDI product lines. In this role, he is responsible for all phases of product planning, development, marketing and sales, as well as execution throughout the product lifecycle. He has many years of experience in sensors and machine vision. Prior to this position, Xing-Fei served as Product Manager at JDS Uniphase (Milpitas, California) and Business Development Manager at LUXELL Technologies (Mississauga, Ontario).  He holds a B.Sc. and M.Sc. Degree in Semiconductor Devices from Zhongshan University (Guangzhou, China) and a Ph.D. in Photonics from the Australian National University (Canberra, Australia). His areas of expertise include: imaging, displays and photonics.

Where:      
The Vision Show
The Hynes Convention Center, Boston, MA
Booth #313

When:       
June 10 - 12, 2008