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QComp Technologies provides robust robotic packaging, material handling systems and automation line integration for a multitude of industries that include glass, solar, consumer products, food, pharmaceutical, plastics, paper and metals. QComp is an employee owned systems integrator with proven experience in palletizing, vision guided, high speed picking, case packing and tray packing. We also have extensive experience in flat glass handling applications. QComp is an ABB preferred partner, a FANUC systems integrator, and a Staubli partner.

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QComp Technologies, Inc. Partners with Hayssen Sandiacre to Offer the Latest Robotic Pick & Glue Technology

POSTED 10/18/2010

ENVILLE, Wisconsin -  QComp Technologies, Inc., a leading robotics integrator, today announced its partnership with Hayssen Sandiacre  to offer the latest in robotic Pick & Glue technology. The combination of the two companies’ expertise and experience will provide customers with state of the art methods for Pick & Glue products for pouch assembly and Retail Marketing offers. The companies will demonstrate the new method at PackExpo International show in Chicago.
“Packagers looking for the most cost effective modular designs that can handle a wide range of products should consider attending the PackExpo show to see a demonstration or our high speed pick & glue system and the Hayssen Form/ Fill/ Seal Machine,” said Tom Doyle, president of QComp Technologies, Inc. “By combining our vision guided picking systems with Hayssen’s expertise we will be able to offer our customers the most efficient and cost effective packaging solutions available.”
As experienced suppliers with proven installations in the food, pharmaceutical and manufacturing industries, QComp’s High Speed (Delta style robot) Picker Systems will compliment Hayssen Form/Fill/Seal solutions and significantly increase customer’s production speeds, improve overall efficiency and quality while maximizing their return on investment.
To see a new Pick & Glue system visit Hayssen’s booth S-806 at the PackExpo International show in Chicago, IL October 31-November 3, 2010.
Founded in 1990, QComp Technologies, Inc. is a robotics integrator, providing automation solutions for a variety of industries. The company designs and builds automated robotic manufacturing cells and materials handling systems, as well as engineers and manufactures drive systems for paper, metal and converting industries. With headquarters in Greenville Wisconsin QComp has sales and service offices in Wausau and Milwaukee, WI. More information can be found on the company’s website at www.qcomptech.com.
HayssenSandiacre is a leading manufacturer and supplier of vertical form/fill/seal packaging machinery, horizontal flow wrapping machinery, computer combination weighing technology, pre-owned and remanufactured machines, and a wide range of upgrade options. Its packaging technology center and packaging laboratory place HayssenSandiacre at the leading edge of technology in its field. HayssenSandiacre serves a variety of industries and is a dominant player in the candy, nut, bakery, snack food, frozen food, fresh produce and cheese industries. More information can be found on the company’s website at www.qcomptech.com.

QComp and the QComp logo are trademarks of QComp Technologies, Inc. All trade names are either trademarks or registered trademarks of their respective holders.