Laser Components USA, Inc. Product

Image of TEESS - Modular OEM TEESS is a modular OEM set comprising a sensor board, a main processing and control unit (MPCU) in a metal casing, a sub-heatsink, wiring and user-friendly software. It was custom-made for the IG series of x-InGaAs line arrays by LASER COMPONENTS. Thanks to its modular design, you may combine the components as required by your application, or use them in combination with your own parts. Sensor Board The sensor board is a separate PCB board and physically houses the array and the heat sink. Its main task is to digitize the analog output signals and communicate them to the main unit. It comes with pre-fabricated holes for the integration of Zeiss and Polytec optics. Sub Heatsink The Peltier cooling of the array creates heat that has to be dispersed by an external heatsink. A block of copper serves as an interface between those two components. It is advisable to attach it to the sensor array using a small amount of thermal epoxy. Both are then easily integrated into the sensor board.

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