SEMICONDUCTOR SUBSTRATE PANEL HANDLING EFEM

IDEAL FRONT-END SOLUTION

JR Automation’s Semiconductor Substrate Panel Handling EFEMs are the ideal front-end solution for handling Copper Core, Glass Core and Glass Panels for process modules dedicated to production of High Density Interconnect substrate for semiconductor packages.

Also referred to as Panel Handling LOT Sorters or Panel Loaders/Unloaders, these EFEMs are compliant with SEMI standards and other standards relevant to your products and the requirements of semiconductor manufacturers. They are customizable to meet your specific needs and can handle up to 600 x 600 mm substrate panels.

EXCEPTIONALLY BROAD STANDARDS COMPLIANCE

These panel handling EFEMs are compliant with a wide range of SEMI, safety and industry standards for design, communication and operation of equipment used in semiconductor manufacturing:

• SECS-GEM  (GEM 300)
• SEMI E84, E181, E181.1, E181.2, E47, E115.1, E30, E37, E37.1, E5, E116, E40, E40.1, E90, E90.1, E94, E94.1, E87, E87.1, F47, S2, S8
• IPCSMEMA 9851
• Hermes
• NFPA79

MANY FUNCTIONAL OPTIONS MAY BE INTEGRATED, INCLUDING:

• Single lane/dual lane conveyor
• Rotate modules
• Flipper modules
• Heaters
• Chillers
• Handoff to multiple process modules within a process tool
• Multiple load ports
• Remote air modules to match process equipment environment

SUITABLE FOR HANDLING A VARIETY OF PANEL SIZES UP TO 600 mm X 600 mm

SIZE CAPABILITIES:

• Up to 600 x 600 mm full panels
• Quarter panels
• 0.2 to 3 mm substrate thicknesses
• Panel weights up to 2.5 kg

SUPERIOR CLEANROOM CAPABILITIES

Meets CLASS 10/ISO 4 Classification standards

SINGLE WIRE COMMUNICATION CAPABILITIES

JR Automation can serve as the single wire SECS/GEM compliant connection to the factory host or provide the required SECS/GEM data to the process equipment via TCP/IP communication in the event the process equipment is the single wire SECS/GEM connection.

Contact us to learn more