Air Bearing Motion Systems for High Precision Laser Dicing / Processing

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include positioning the cut accurately, to minimize the loss of material, and to minimize distortions of the components. Air bearing linear and rotary positioning stages provide the speed, accuracy and clean room compatibility required.

ROI Calculator

Discover the potential cost savings of robotic automation over a 20-year system life

This calculator compares your current manual labor costs against the total cost of owning and operating a robotic system over its 20-year lifespan.

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