Videos
Air Bearing Motion Systems for High Precision Laser Dicing / Processing
Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include positioning the cut accurately, to minimize the loss of material, and to minimize distortions of the components. Air bearing linear and rotary positioning stages provide the speed, accuracy and clean room compatibility required.
PI (Physik Instrumente) LP
PI is a leading manufacturer of precision motion control and automation systems, hexapod 6-axis parallel robotic stages, air bearing motion systems, Gantry Systems, 3D printing, laser machining, and piezoelectric nano-positioning solutions. Applications include photonics, semiconductor technology, medical engineering, assembly, inspection,
Discover how PI (Physik Instrumente) LP can support your automation journey with their complete range of solutions and expertise.
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PI is a leading manufacturer of precision motion control and automation systems, hexapod 6-axis parallel robotic stages, air bearing motion systems, Gantry Systems, 3D printing, laser machining, and piezoelectric nano-positioning solutions. Applications include photonics, semiconductor technology, medical engineering, assembly, inspection,
AC500 PM595 Advanced PLC Addresses Emerging Challenges in Machinery Control
The brand new AC500 PM595 features a multi-processor system with the performance to handle the most demanding tasks.