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PI is a leading manufacturer of precision motion control and automation systems, hexapod 6-axis parallel robotic stages, air bearing motion systems, Gantry Systems, 3D printing, laser machining, and piezoelectric nano-positioning solutions. Applications include photonics, semiconductor technology, medical engineering, assembly, inspection,

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Air Bearing Motion Systems for High Precision Laser Dicing / Processing

POSTED 08/07/2019

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include positioning the cut accurately, to minimize the loss of material, and to minimize distortions of the components. Air bearing linear and rotary positioning stages provide the speed, accuracy and clean room compatibility required.