LEC-BTS SMARC Module
Ultra small form factor targets power-efficient mobile applications and offers fast time-to-market and high reliability
San Jose, CA – ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today introduced a new SMARC form factor computer-on-module, the LEC-BTS, running a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.46 to 1.91 GHz with up to 4GB DDR3L memory at 1066/1333 MHz. The ADLINK LEC-BTS module delivers top-of-the-line performance with efficient power consumption targeting a new generation of mobile applications requiring industrial-grade stability and reliability.
The SMARC (Smart Mobility ARChitecture) form factor is a versatile ultra small footprint computer-on-module defined predominantly by ADLINK and Kontron and approved by the SGET (Standardization Group for Embedded Technology) consortium. SMARC is an open and global standard for new generation embedded applications featuring low power, low cost and high performance, taking advantages from both legacy x86 and ARM-based designs. ADLINK has also released SMARC modules with ARM-based cores.
The ADLINK LEC-BTS is a short size 82 mm x 50 mm SMARC module. The low power envelope of the SMARC form factor (5 W to 10 W depending on number of cores and usage) allows for passive cooling and enables smaller, quieter, and cleaner systems. Although small in size, the LEC-BTS provides a wide variety of I/O interfaces to enable development of new and innovative applications, including both PC-type interfaces such as 3x PCIe x1 , SATA 3Gb/s, GbE, HD audio and HDMI; and modern ARM-type interfaces such as SPI, I2C, I2S. MIPI CSI camera, single channel LVDS (24-bit), 3x USB 2.0, 1x USB 3.0, 12x GPIO, 1x SDIO, and 2x UART serial ports.
The LEC-BTS is designed for portable or small stationary systems, with application scenarios ranging from industrial automation and medical testing and measurement to transportation and digital signage, and is especially suited for systems requiring high performance graphics in mobile applications. LEC-BTS modules can operate in an extremely wide temperature range of -40°C to +85°C. Standard temperature SKUs supporting 0°C to 60°C operation are also available.
The ADLINK LEC-BTS is a building block for the Intel® IoT Platform framework with Wind River and McAfee software integration. Paired with ADLINK’s device-to-cloud platform SEMA (Smart Embedded Management Agent) Cloud that enables remote monitoring control and management, the LEC-BTS is ideal for developing IoT devices with a secure connection to the cloud.
For more information, please visit: http://www.adlinktech.com/Computer-on-Module/SMARC
ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGeT).
ADLINK is a global company with headquarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).