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At LMI Technologies we work to advance quality and productivity with 3D sensor technology. Our award-winning, FactorySmart® solutions improve the quality and efficiency of factory production by providing fast, accurate, reliable inspection solutions that leverage smart 3D technologies. Unlike contact based measurement or 2D vision, our products remove complexity and dramatically reduce implementation cost while achieving repeatable, highly accurate measurement. To learn more about how LMI's inspection solutions can benefit your business, we invite you to contact us.

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FlexScan3D 3.3 Software for HDI 3D Scanners

POSTED 04/17/2014

Vancouver, Canada – LMI Technologies (LMI), a leading developer of 3D scanning, measurement, and data visualization technologies, announces the official release of the next version of its 3D scanning software, FlexScan3D 3.3. This proprietary software is the 3D scanning engine that powers the company’s line of HDI 3D Scanners. FlexScan3D 3.3 includes new features that optimize the 3D scanning workflow from capturing scans, to building scans into a digital 3D model, to cleaning the model with new advanced post-processing capabilities.
FlexScan3D 3.3 Software for HDI 3D Scanners

“Scan data acquired from a 3D scanner undergo many processing steps to create digital 3D models from real world objects that are then used in reverse engineering, 3D printing, visualization, or inspection,” said Terry Arden, CEO of LMI Technologies. “The new features introduced into FlexScan3D now automate some of the steps that were previously done manually. As a result, the scanning process to build 3D models is now simplified and made more efficient, allowing users to complete the scanning portion of their project in a faster amount of time.” 

FlexScan3D 3.3 offers the following benefits:

Easy Scan Automatically Determines the Best Exposure for an Object
When capturing 3D scans, users typically need to manually set the best exposure for an object to get optimum scan results. This process would require the user to set the exposure control that can lead to under or over exposure. With the Easy Scan smart exposure control feature, FlexScan3D automatically determines the best exposure for an object to get quality scan results every time. 

Cut Plane Simplifies 3D Model Building 
Using the Cut Plane feature, users can capture cleaner scans with the HDI 3D Scanner during the scan acquisition stage. FlexScan3D software permits users to define a background plane and eliminate it automatically in all subsequent scans, capturing only scans with the target object. This drastically reduces the amount of time to clean up scans during the post-processing stage.

New Advanced Post-Processing Capabilities Include Interactive Hole Filling and Creating Water Tight Models
In addition to its powerful 3D capture capabilities, the LMI development team continues to improve FlexScan3D’s advanced post-processing capabilities. A major development in this version includes interactive hole filling that allows users to select a hole or a region for hole filling. Users can control the process by specifying hole filling parameters. The result is a 3D model that is water tight–no holes, gaps, or openings–ready for export and use.

Starting today, the HDI 3D Scanners are available with the latest version of FlexScan3D 3.3, including the HDI Advance and the HDI 120. This version now supports languages including German, French, and Chinese in addition to English. 

LMI Technologies will feature the HDI 120 3D Scanner with the new version of FlexScan3D 3.3 at Control, the world's leading trade fair for quality assurance, in Stuttgart, Germany on May 6-9, 2014. 

About LMI Technologies:
At LMI Technologies, we are passionate about developing innovative 3D scanning, measurement, and data visualization technologies that solve complex problems in a simple way. We take our knowledge and experience from working over 35 years in the field and connect our customers to 3D solutions that enable them to achieve better business results. We build our products from the chip level up: from concept, design, to manufacturing. With offices worldwide, we are committed to delivering the best 3D sensors, 3D smart sensors, and 3D scanners for your application.